| Output options | Fixed Output |
| Iout (Max) (A) | 0.1 |
| Vin (Max) (V) | 30 |
| Vin (Min) (V) | 6.7 |
| Vout (Max) (V) | 15 |
| Vout (Min) (V) | 5 |
| Fixed output options (V) | 5, 6.2, 9, 12, 15 |
| Noise (uVrms) | 40 |
| Iq (Typ) (mA) | 2 |
| Thermal resistance θJA (°C/W) | 108 |
| Rating | Catalog |
| Load capacitance (Min) (μF) | 0.01 |
| Regulated outputs (#) | 1 |
| Accuracy (%) | 4 |
| PSRR @ 100 KHz (dB) | 40 |
| Dropout voltage (Vdo) (Typ) (mV) | 1600 |
| Operating temperature range (C) | -40 to 85, 0 to 125, -40 to 125 |
- For lower cost alternative, see the UA78L
- Input voltage up to 30 V
- Output voltage tolerances of ±5% over the temperature range
- Available output voltages: 5 V, 6.2 V, 8.2 V, 9 V, 12 V, and 15 V
- Output current of 100 mA
- Output transistor safe area protection
- Internal thermal overload protection
- Internal short-circuit current limit
- No external components
- Available in tiny DSBGA package
- Available in 3-pin TO-92 and 8-pin SOIC low profile packages
The LM78L series (LM78Lxx throughout this document) of three terminal positive regulators is available with several fixed output voltages, making them useful in a wide range of applications. Used as a Zener-diode and resistor combination replacement, the LM78Lxx usually provides an effective output impedance improvement of two orders of magnitude and lower quiescent current. These regulators can provide local, on-card regulation, eliminating distribution problems associated with single-point regulation. The available voltages allow the LM78Lxx to be used in logic systems, instrumentation, HiFi, and other solid-state electronic equipment.
The LM78Lxx is available in the plastic TO-92 (LP) package, the SOIC (D) package, and a chip-sized package (8-Bump DSBGA) using TI?s DSBGA package technology. With adequate heat sinking, the regulator can deliver 100-mA output current. Current limiting is included to limit the peak output current to a safe value. Safe area protection for the output transistors is provided to limit internal power dissipation. If internal power dissipation is too high for the heat sinking provided, the thermal shutdown circuit prevents the IC from overheating.
See the AN-1112 DSBGA Wafer Level Chip Scale Package application note for DSBGA considerations. For more information on the TO-92 package, see the TO-92 Packing Options/Ordering Instructions application report.
