適用IC封裝類型:DIP;間距:2.54mm;總針腳數(shù):14;行距:7.62mm;觸頭鍍層:-;
BOOMELE
828-Ag11D-Es=Socket Assy
TE Connectivity (Tyco Electronics)
IC socket spacing 2.54mm, 16Pin line spacing 7.62mm, straight plug
BOOMELE
適用IC封裝類型:DIP;間距:2.54mm;總針腳數(shù):10;行距:7.62mm;圓孔/方孔:圓孔;工作溫度范圍:-40℃~+105℃;
XKB
適用IC封裝類型:DIP;間距:2.54mm;總針腳數(shù):12P;行距:7.62mm;圓孔/方孔:圓孔;工作溫度范圍:-40℃~+105℃;
XKB
CONN SOCKET SIP 20POS GOLD
Omron
IC socket spacing 2.54mm 40Pin line spacing 15.24mm straight plug
BOOMELE
IC socket spacing 2.54mm, 6Pin straight plug
BOOMELE
8058-39G3=To5 Socket 200 Circ
TE Connectivity (Tyco Electronics)
DIP Circular Holes -40℃~+105℃ 7.62mm 8 2.54mm DIP-8 IC Sockets ROHS
XFCN