Advanced Process Technology

　　Ultra Low On-Resistance

　　Dynamic dv/dt Rating

　　175°C Operating Temperature

　　Fast Switching l Fully Avalanche Rated

　　Description

　　Advanced HEXFET? Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low onresistance per silicon area. This benefit， combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for， provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

　　The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application.

　　The through-hole version （IRF3205L） is available for low-profile applications