用工業(yè)SBCS嵌入式開(kāi)發(fā)軟件的選擇

　　克服嵌入式開(kāi)發(fā)的障礙

　　已經(jīng)開(kāi)發(fā)了許多開(kāi)發(fā)工具和支持的硬件和軟件產(chǎn)品，以幫助減少嵌入式開(kāi)發(fā)風(fēng)險(xiǎn)，加快從小型消費(fèi)設(shè)備到高性能工業(yè)控制和遙感設(shè)備等各種產(chǎn)品的上市時(shí)間。即使啟動(dòng)也可能是一個(gè)挑戰(zhàn)，因?yàn)檐浖_(kāi)發(fā)取決于硬件是否準(zhǔn)備就緒。隨后的集成受到硬件和軟件之間的許多依賴(lài)關(guān)系，從設(shè)備驅(qū)動(dòng)程序、適配層和OS內(nèi)核到應(yīng)用程序接口（API）和應(yīng)用程序本身。雖然必須面對(duì)這些問(wèn)題，但開(kāi)發(fā)團(tuán)隊(duì)通常希望將資源集中到應(yīng)用程序級(jí)別，以創(chuàng)建獨(dú)特的特性，從而使產(chǎn)品在其市場(chǎng)上與眾不同。

　　為了幫助克服一些早期的障礙，芯片供應(yīng)商已經(jīng)創(chuàng)建了開(kāi)發(fā)平臺(tái)，它可以解決許多硬件設(shè)計(jì)難題，加快軟件開(kāi)發(fā)工作的進(jìn)程。在選擇一個(gè)提供所有必需特性并接近理想配置的平臺(tái)之后，團(tuán)隊(duì)可以在項(xiàng)目進(jìn)展時(shí)對(duì)硬件進(jìn)行微調(diào)，以添加獨(dú)特的或增值的特性。最終，可以為生產(chǎn)目的創(chuàng)建一個(gè)定制的、小型化的硬件版本。

　　On the other hand， a vast selection of single board computers （SBCs） or computer on module （COM） hardware is available， featuring popular processor architectures such as x86， Intel? Atom?， or ARM?， in various miniature form factors such as PC/104 or Mini ITX. These can be used as a platform for software development， and then scaled into production with little or no further modification to the hardware.

　　Any platform for embedded development needs a board support package （BSP） to provide essential software for controlling features specific to the hardware. The various elements of the BSP include drivers for devices on the board， an adaptation layer to enable the OS to communicate with the board hardware， and a boot loader for loading and starting up the OS. Because these various software components exist to connect the hardware with the OS， creating the BSP depends on knowledge of the OS and its characteristics.
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