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OMAP3525 應(yīng)用處理器

數(shù)據(jù)： OMAP3530/25 Applications Processor 數(shù)據(jù)表

描述

OMAP3530和OMAP3525器件基于增強型OMAP 3架構(gòu)。

OMAP 3架構(gòu)旨在提供最佳的OMAP 3架構(gòu)。類視頻，圖像和圖形處理足以支持以下內(nèi)容：

流媒體視頻
視頻會議
高分辨率靜止圖像

該設(shè)備支持高級操作系統(tǒng)（HLOS），例如：

Linux®
Windows®CE

此OMAP設(shè)備包含高性能移動產(chǎn)品所需的最先進的電源管理技術(shù)。

以下子系統(tǒng)是其中的一部分設(shè)備：

基于ARM Cortex-A8微處理器的微處理器單元（MPU）子系統(tǒng)
帶有C64x +數(shù)字信號處理器（DSP）內(nèi)核的IVA2.2子系統(tǒng)< /li>
用于支持顯示的3D圖形加速的PowerVR SGX子系統(tǒng)（僅限OMAP3530設(shè)備）
支持相機圖像信號處理器（ISP）端口多種格式和連接到各種圖像傳感器的接口選項
顯示子系統(tǒng)具有多種并發(fā)圖像處理功能，以及支持各種顯示器的可編程接口。顯示子系統(tǒng)還支持NTSC和PAL視頻輸出。
3級（L3）和4級（L4）互連，為多個啟動器提供高帶寬數(shù)據(jù)傳輸?shù)絻?nèi)部和外部存儲器控制器以及打開芯片外設(shè)

該器件還提供：

全面的電源和時鐘管理方案，可實現(xiàn)高性能，低功耗運行，以及超低功耗待機功能。該器件還支持SmartReflex自適應(yīng)電壓控制。這種用于自動控制模塊工作電壓的電源管理技術(shù)可降低有功功耗。
使用封裝上封裝（POP）實現(xiàn)的存儲器堆疊功能（僅限CBB和CBC封裝）

OMAP3530和OMAP3525器件采用515引腳s-PBGA封裝（CBB后綴），515引腳s-PBGA封裝（CBC后綴）和423引腳s- PBGA封裝（CUS后綴）。 CUS包中沒有CBB和CBC包的某些功能。（有關(guān)封裝差異，請參見表1-1）。

本數(shù)據(jù)手冊介紹了OMAP3530和OMAP3525應(yīng)用處理器的電氣和機械規(guī)格。除非另有說明，否則本數(shù)據(jù)手冊中的信息適用于OMAP3530和OMAP3525應(yīng)用處理器的商用和擴展溫度版本。本數(shù)據(jù)手冊由以下部分組成：

第2節(jié)：端子描述：分配，電氣特性，多路復(fù)用和功能描述
第3節(jié)：電氣特性：電源域，工作條件，功耗和直流特性
第4節(jié)：時鐘規(guī)范輸入和輸出時鐘，DPLL和DLL
第5節(jié)：視頻Dac規(guī)范
第6節(jié)：時序要求和開關(guān)特性
第7節(jié)：封裝特性：可用封裝的熱特性，器件命名和機械數(shù)據(jù)

特性

OMAP3530 and OMAP3525 Devices:
- OMAP™ 3 Architecture
- MPU Subsystem
  - Up to 720-MHz ARM® Cortex™-A8 Core
  - NEON™ SIMD Coprocessor
- High-Performance Image, Video, Audio (IVA2.2™) Accelerator Subsystem
  - Up to 520-MHz TMS320C64x+™ DSP Core
  - Enhanced Direct Memory Access (EDMA) Controller (128 Independent Channels)
  - Video Hardware Accelerators
- PowerVR® SGX™ Graphics Accelerator (OMAP3530 Device Only)
  - Tile-Based Architecture Delivering up to 10 MPoly/sec
  - Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
  - Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
  - Fine-Grained Task Switching, Load Balancing, and Power Management
  - Programmable High-Quality Image Anti-Aliasing
- Fully Software-Compatible with C64x and ARM9™
- Commercial and Extended Temperature Grades
Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+ DSP Core
- Eight Highly Independent Functional Units
  - Six ALUs (32- and 40-Bit), Each Supports Single 32-Bit, Dual 16-Bit, or Quad 8-Bit Arithmetic per Clock Cycle
  - Two Multipliers Support Four 16 x 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 x 8-Bit Multiplies (16-Bit Results) per Clock Cycle
- Load-Store Architecture with Nonaligned Support
- 64 32-Bit General-Purpose Registers
- Instruction Packing Reduces Code Size
- All Instructions Conditional
- Additional C64x+ Enhancements
  - Protected Mode Operation
  - Exceptions Support for Error Detection and Program Redirection
  - Hardware Support for Modulo Loop Operation
C64x+ L1 and L2 Memory Architecture
- 32KB of L1P Program RAM and Cache (Direct Mapped)
- 80KB of L1D Data RAM and Cache (2-Way Set-Associative)
- 64KB of L2 Unified Mapped RAM and Cache (4-Way Set-Associative)
- 32KB of L2 Shared SRAM and 16KB of L2 ROM
C64x+ Instruction Set Features
- Byte-Addressable (8-, 16-, 32-, and 64-Bit Data)
- 8-Bit Overflow Protection
- Bit Field Extract, Set, Clear
- Normalization, Saturation, Bit-Counting
- Compact 16-Bit Instructions
- Additional Instructions to Support Complex Multiplies
ARM Cortex-A8 Core
- ARMv7 Architecture
  - TrustZone®
  - Thumb®-2
  - MMU Enhancements
- In-Order, Dual-Issue, Superscalar Microprocessor Core
- NEON Multimedia Architecture
- Over 2x Performance of ARMv6 SIMD
- Supports Both Integer and Floating-Point SIMD
- Jazelle® RCT Execution Environment Architecture
- Dynamic Branch Prediction with Branch Target Address Cache, Global History Buffer, and 8-Entry Return Stack
- Embedded Trace Macrocell (ETM) Support for Noninvasive Debug
ARM Cortex-A8 Memory Architecture:
- 16-KB Instruction Cache (4-Way Set-Associative)
- 16-KB Data Cache (4-Way Set-Associative)
- 256-KB L2 Cache
112KB of ROM
64KB of Shared SRAM
Endianess:
- ARM Instructions – Little Endian
- ARM Data – Configurable
- DSP Instruction and Data - Little Endian
External Memory Interfaces:
- SDRAM Controller (SDRC)
  - 16- and 32-Bit Memory Controller with 1GB of Total Address Space
  - Interfaces to Low-Power Double Data Rate (LPDDR) SDRAM
  - SDRAM Memory Scheduler (SMS) and Rotation Engine
- General Purpose Memory Controller (GPMC)
  - 16-Bit-Wide Multiplexed Address and Data Bus
  - Up to 8 Chip-Select Pins with 128-MB Address Space per Chip-Select Pin
  - Glueless Interface to NOR Flash, NAND Flash (with ECC Hamming Code Calculation), SRAM, and Pseudo-SRAM
  - Flexible Asynchronous Protocol Control for Interface to Custom Logic (FPGA, CPLD, ASICs, and so forth)
  - Nonmultiplexed Address and Data Mode (Limited 2-KB Address Space)
System Direct Memory Access (sDMA) Controller (32 Logical Channels with Configurable Priority)
Camera Image Signal Processor (ISP)
- CCD and CMOS Imager Interface
- Memory Data Input
- BT.601 (8-Bit) and BT.656 (10-Bit) Digital YCbCr 4:2:2 Interface
- Glueless Interface to Common Video Decoders
- Resize Engine
  - Resize Images From 1/4x to 4x
  - Separate Horizontal and Vertical Control
Display Subsystem
- Parallel Digital Output
  - Up to 24-Bit RGB
  - HD Maximum Resolution
  - Supports Up to 2 LCD Panels
  - Support for Remote Frame Buffer Interface (RFBI) LCD Panels
- 2 10-Bit Digital-to-Analog Converters (DACs) Supporting:
  - Composite NTSC and PAL Video
  - Luma and Chroma Separate Video (S-Video)
- Rotation 90-, 180-, and 270-Degrees
- Resize Images From 1/4x to 8x
- Color Space Converter
- 8-Bit Alpha Blending
Serial Communication
- 5 Multichannel Buffered Serial Ports (McBSPs)
  - 512-Byte Transmit and Receive Buffer (McBSP1, McBSP3, McBSP4, and McBSP5)
  - 5-KB Transmit and Receive Buffer (McBSP2)
  - SIDETONE Core Support (McBSP2 and McBSP3 Only) For Filter, Gain, and Mix Operations
  - Direct Interface to I2S and PCM Device and TDM Buses
  - 128-Channel Transmit and Receive Mode
- Four Master or Slave Multichannel Serial Port Interface (McSPI) Ports
- High-, Full-, and Low-Speed USB OTG Subsystem (12- and 8-Pin ULPI Interface)
- High-, Full-, and Low-Speed Multiport USB Host Subsystem
  - 12- and 8-Pin ULPI Interface or 6-, 4-, and 3-Pin Serial Interface
  - Supports Transceiverless Link Logic (TLL)
- One HDQ™/1-Wire® Interface
- Three UARTs (One with Infrared Data Association [IrDA] and Consumer Infrared [CIR] Modes)
- Three Master and Slave High-Speed Inter-Integrated Circuit (I²C) Controllers
Removable Media Interfaces:
- Three Multimedia Card (MMC)/Secure Digital (SD) with Secure Data I/O (SDIO)
Comprehensive Power, Reset, and Clock Management
- SmartReflex™ Technology
- Dynamic Voltage and Frequency Scaling (DVFS)
Test Interfaces
- IEEE 1149.1 (JTAG) Boundary-Scan Compatible
- ETM Interface
- Serial Data Transport Interface (SDTI)
12 32-Bit General-Purpose Timers
2 32-Bit Watchdog Timers
1 32-Bit 32-kHz Sync Timer
Up to 188 General-Purpose I/O (GPIO) Pins (Multiplexed with Other Device Functions)
65-nm CMOS Technologies
Package-On-Package (POP) Implementation for Memory Stacking (Not Available in CUS Package)
Discrete Memory Interface (Not Available in CBC Package)
Packages:
- 515-pin s-PBGA Package (CBB Suffix),
  .5-mm Ball Pitch (Top), .4-mm Ball Pitch (Bottom)
- 515-pin s-PBGA Package (CBC Suffix),
  .65-mm Ball Pitch (Top), .5-mm Ball Pitch (Bottom)
- 423-pin s-PBGA Package (CUS Suffix),
  .65-mm Ball Pitch
1.8-V I/O and 3.0-V (MMC1 Only),
0.985-V to 1.35-V Adaptive Processor Core Voltage
0.985-V to 1.35-V Adaptive Core Logic Voltage
Note: These are default Operating Performance Point (OPP) voltages and could be optimized to lower values using SmartReflex AVS.

參數(shù) 與其它產(chǎn)品相比 OMAP 處理器


Applications
Operating Systems
DSP
DSP MHz
Arm CPU
Arm MHz (Max.)
On-Chip L2 Cache/RAM
DRAM
USB
UART (SCI)
I2C
SPI
Video Port (Configurable)
Operating Temperature Range (C)

OMAP3525
Audio Communications and Telecom Consumer Electronics Energy Industrial Medical Security Space Avionics and Defense Video and Imaging
Android Neutrino Integrity Tornado Windows Embedded CE Linux VxWorks
1 C64x
430
1 ARM Cortex-A8
600
256 KB (ARM Cortex-A8) 96 KB (DSP)
LPDDR
2
3
3
4
Decode Encode Analytics Image Enhance
-40 to 105 0 to 90
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