集成RF提供容易進(jìn)入物聯(lián)網(wǎng)節(jié)點(diǎn)發(fā)展

　　可以說，物聯(lián)網(wǎng)目前正在經(jīng)歷一些“成長(zhǎng)的痛苦”方面，它做（或不）包括。雖然它可能不會(huì)被視為驅(qū)動(dòng)的趨勢(shì)，嵌入式電子行業(yè)肯定使它，無疑是在一個(gè)制高點(diǎn)的形狀。

　　一些在這個(gè)行業(yè)誰(shuí)懂技術(shù)在最外面的一個(gè)水平不覺得物聯(lián)網(wǎng)將是更大的東西的一個(gè)子集：一切的互聯(lián)網(wǎng)；但除了語(yǔ)義明確的機(jī)會(huì)是巨大的，估計(jì)高達(dá)2020 500億的設(shè)備，甚至有人預(yù)測(cè)2025打1兆。

　　Given that many of those devices will be small nodes on larger networks， the Bill of Materials will need to be small in terms of components and total cost. For this reason it follows that every node， however big or small， will have at its heart some form of microcontroller. Given the pressure developers will be under to keep the BoM as low as possible， it seems probable that they will be selecting only those MCUs that offer the right combination of features within their price and power budget.