This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance data are included as reference.

The Application Note is written generically to encompass various Micro Dual And Quad Flat Pack No-lead (uDFN / QFN) packages assembled internally and externally. It should be noted that device specific information is not provided. This document serves only as a guideline to help develop a user specific solution. Actual experience and development efforts are still required to optimize the process per individual device requirements and practices.
The document combines information from two separate studies. When recommendation varies between the two studies, both views are provided and the source noted.