通過(guò)SYMMIC與AWR設(shè)計(jì)環(huán)境的熱分析軟件的基于腳本的結(jié)合，實(shí)際的熱模擬作為射頻/微波設(shè)計(jì)流程的一個(gè)不可分割的組成部分而不是一個(gè)機(jī)械的工程軟件，對(duì)于單片微波集成電路的設(shè)計(jì)者來(lái)說(shuō)，成為了一個(gè)現(xiàn)實(shí)。SYMMIC的基于模板的方法，并且純粹的仿真速度與集成到Microwave office中的腳本相結(jié)合，使得更精確的器件模擬電路設(shè)計(jì)是可能的。不必再采用一個(gè)更詳細(xì)的電磁仿真，可靠性和電氣性能在仿真中可同時(shí)考慮。因此，軟件將持續(xù)升溫。單片微波集成電路的設(shè)計(jì)者將準(zhǔn)備好使用AWR Connected for SYMMIC。

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